Podcast: The future of electronics goes beyond circuit boards NSF-supported researcher Ethan Secor discusses a specialized additive manufacturing technique, the materials involved, and the resulting circuits that can be customized for complex 3D surfaces... Read more at nsf.gov
Researchers observe fundamental mechanism causing material 'work hardening'
Researchers have directly observed the microscopic mechanism involved in "work hardening," a process by which materials like metals become stronger when deformed by hammering or stretching. The research provides a deeper understanding of how this…
Read more at nsf.gov
Researchers have directly observed the microscopic mechanism involved in "work hardening," a process by which materials like metals become stronger when deformed by hammering or stretching. The research provides a deeper understanding of how this…
Read more at nsf.gov
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