Podcast: The future of electronics goes beyond circuit boards NSF-supported researcher Ethan Secor discusses a specialized additive manufacturing technique, the materials involved, and the resulting circuits that can be customized for complex 3D surfaces... Read more at nsf.gov
New hydrogel is as strong as spider silk and sticky as mussel foot protein
Engineers create easy-to-use and effective underwater adhesive
More at https://www.nsf.gov/discoveries/disc_summ.jsp?cntn_id=304104&WT.mc_id=USNSF_1
This is a Research News item.
Read more at nsf.gov
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